LAS VEGAS and Taipei, Taiwan, Dec. 28, 2022/PRNewswire/ -- The 42nd Anniversary Gala Dinner of Hsinchu Science Park themed "Innovation as Driving Force, Sustainability as Focus" was held recently, where a host of top-performing companies were hosted during of the big event. Etron Technology, Inc. (TPEx: 5351), the world's leading IC design company promoting heterogeneous integration, has been recognized with the R&D Achievement Award for R&D excellence. This award serves not only as a recognition of Etron's long-standing commitment to R&D and excellence in commercializing technologies, but also as an encouragement to others to engage in corporate sustainability and contribute to the long-term development of the industry.
Established for over 31 years and firmly anchored in Hsinchu Science Park (HSP) in Taiwan, Etron has benefited from HSP's unremitting efforts to create an excellent industrial environment aiming at continuous innovation and concrete R&D achievements allow among companies. The Hsinchu Science Park Bureau (HSPB) continues to encourage companies to engage in R&D at HSP and obtain patents to protect their R&D achievements, thereby promoting the vigorous development of Taiwan's semiconductor industry and its connections with the world. HSPB's initiatives to promote industrial innovation and technology commercialization have not only fueled economic development and created an excellent regional environment, but also brought positive development of leading ideas and humanities to Etron. Recipient of the R&D Achievement Award, Etron is committed to further expanding its business in domestic and international markets, creating a Taiwanese brand image with a global perspective, attracting international cooperation, and making interdisciplinary connections to spread the spirit of Taiwan, and continues to shine on the world international stage.
Etron's CEO, Dr. Nicky Lu founded the company after returning from the US in the 1990s. He is actively engaged in advanced semiconductor manufacturing and design technologies with an insistence on independent research and development. In the National Submicron Project, jointly established by the Department of Commerce (R.O.C.) and the Industrial Technology Research Institute (ITRI), Dr. Lu, together with ITRI's Electronic and Optoelectronic System Research Laboratories, successfully developed Taiwan's first 8-inch wafer and 0.5-micron logic, SRAM and DRAM process technology, marking an important milestone in Taiwan's development of advanced wafer technology that led to the large-scale development of the semiconductor industry and the influx of capital into HSP. At the same time, Dr. Lu also made great contributions to the development of R&D talents in the semiconductor industry and laid a solid foundation on Taiwan's path to becoming a central manufacturing cluster in the semiconductor industry chain. As a result, the resilience of the Taiwanese chip supply chain has received serious attention from the global community.
From 1991 to 1995, Dr. Lu Etron to work with ITRI/ERSO teams on the National Submicron Project (NSP) aimed at developing advanced IC technologies for Taiwan. He was responsible for defining technologies with scaling strategies, optimizing technology and design with architectures that accelerate the transition of technology nodes, and designing diagnostic chip vehicles to enable faster DRAM/SRAM/Logic product migrations, which in turn served as key serves as Taiwan could Skips other countries in silicon technology from the old 6 inch wafer, 1.0 micron process/design to its own 8 inch wafer, 0.5 micron, advanced design and manufacturing capacities. NSP's success has enabled Taiwan's IC industry to grow from US$1 billion in 1990 to US$169 billion in 2022(e) (~30% of total sales).
During this period, Taiwan's semiconductor industry ushered in a boom era, which not only spawned a multitude of large semiconductor manufacturers, but also prospered IC design companies. At that time, in addition to the effective development of logic design methods with advanced EDA tools, Etron launched Taiwan's first 16MB DRAM and 4MB SRAM, which led to the successful development of many IC design companies.
Heterogeneous integration was first introduced by Dr. Lu proposed in his plenary lecture on "Emerging Era of Heterogeneous Integration" at the International Solid-State. Circuits Conference (ISSCC) in 2004. As early as 2000, Etron launched the Known-Good-Die Memory (KGDM), which successfully tapped into the heterogeneous integration product series of various manufacturers such as Intel, Seagate and MediaTek, thereby pioneering the promotion of heterogeneous integration in the global semiconductor industry.The trend of innovative heterogeneous IC platformhas triggered the launch of the multi-stack KGD chip, also known as the heterogeneous integration of Si-centric technology, which is now recognized worldwide as a specific solution, different from Moore's law (i.e. the trend of homogeneous transistor on a chip ). , which can lead the semiconductor industry to grow continuously towards the trillion-dollar era of parallel development of circuit integration technology.
As advanced DRAM products are needed for heterogeneous integration applications, Etron introduceda new platform forheterogeneous integration ofAI and DRAM. For example the new RPC DRAM®x16bit DDR3 SDRAM has half the number of pins than products in the same class and is only one-tenth the size of similar products to achieve both small factor factor and cost reduction, offering both cost and power consumption advantages. Etron's own RPC DRAM®is the world's first and smallest DRAM in a wafer-level chip-scale package (WLCSP) that supports high bandwidth and meets the requirements of micro-terminals of the artificial intelligence (AI) generation. After observing customers' needs in product usage, Etron developed a new business model to offer a total solution with the integration of controller and DRAM.
Source: New RPC DRAM®by Etron Tech
KOOLDRAMTM, another Etron innovation, is a product born out of the physical limitations of traditional DRAM productsdeveloped by reversing the design of DRAM circuits, can greatly extend DRAM data retention time and increase DRAM overall performance in line with JEDEC standard. It is also particularly suitable for high temperature applications. This product overcomes the long-standing problem of loss of efficiency when accessing data in high-temperature environments that traditional DRAMs are subjected to. Meanwhile, Etron's RPC DRAM, currently the smallest DRAM capable of supporting high bandwidth, is an excellent solution for customers given size, cost and power consumption challenges. It has also passed international automotive certification standards (i.e. AEC-Q100 Level 2). With a long-standing commitment to developing innovative memory products, Etron also promotes AI-on-chips with heterogeneous integration of components to achieve R&D results and realize the commercialization of the technology.
As one of the few design companies in the world that is proficient in both memory and logic ICs, Etron's dedication has resulted in a comprehensive product line ranging from master control, device, transmission cable to USB audio and video capture -Interface products ranges USB high-speed transmission interface products over the years. Special,The USB Type-C E-Marker Controller IC-EJ903 received the Excellent Manufacturer Innovative Product Award from HSP. EJ903, one of the key components in ultra-high-speed transmission cables, is the world's first equipped with both USB4TMand thunderboltTMcertifications. It has been used by manufacturers of PC peripheral cables and in fiber optic cables, and has also been incorporated into USB4TMproducts, which not only encourages end users to use these products, but also accelerates the adoption of USB4TM.
In an effort to take advantage of memory-plus-logic IC design, Etron actively promotes the heterogeneous integration of products into AI terminals. At present, eYs3D Microelectronics, Co., a subsidiary of Etron, has developedAI-enabled computer vision technology and products. For example,XINK's next-generation robotic vision platform is based on eCV1, the company's first-ever AI chipwhich uses a 28nm and a 12nm dual chipset. This AI chip has been officially shared with customers to develop new applications. Compared to traditional chips, this AI chip has improved performance and is able to process a huge amount of data in a shorter time, making it widely used in fast-growing fields such as AI and machine learning, Internet of Things, and wireless communication devices.
Source: Next Generation XINK Robot Vision Platform by eYs3D Microelectronics
Ushering in the era of the integrative application of intelligenceN, Etron actively promotes the heterogeneous integration of products into product innovation. As Etron intensifies its efforts to develop innovative technologies and realize mass production of advanced products, it sets high demands on product quality and accelerates the development of high-performance, low-power consumption DRAM products. At the same time, Etron has also initiated heterogeneous integration of AI, logic IC and DRAM and plans to obtain patents around the world as the company expects to capitalize on markets arising from innovative products.
DeCloakFace Named a CES® 2023 Innovation Awards Winner
The Innovation Awards are sponsored by CTA, the host and organizer of CES, recognized worldwide as the global stage for innovation and the most influential technology event. Etron Tech (TPEx: 5351.TW), a world-class fabless IC design and product company specializing in application-driven memory, today announced that its new start-up innovation has received the CES®2023 Innovation Award. From a record number of over 2,100 submissions, DeCloakFace, a deep learning facial recognition model using veiled images, was selected as the winner in the Cybersecurity & Personal Privacy category. It will be developed by Etron's new start-up/affiliate - DeCloak Intelligences.
With the rapid development of artificial intelligence (AI) technology, the adoption of facial recognition for identity verification is becoming more and more popular. DeCloak Intelligences developed DeCloakFace, a deep learning facial recognition model using obfuscated images that aims to protect the privacy of companies that use facial recognition as a login or access control option. DeCloakFace does not require a hardware key for its solution and performs secure identity verification in a way that does not compromise privacy. The innovative and unprecedented solution has attracted a lot of attention in industries including: finance, healthcare, cryptocurrency and e-signature platforms where identity verification or multi-factor authentication is required.
With a highly efficient algorithm architecture, DeCloakFace only needs a veiled image for its microsecond-level AI training. When users log in with DeCloakFace, their face data is securely protected as only the cloaked images are sent to the cloud and their actual face photos are not stored on-premises or sent to the cloud.
CES 2023 will be held in Las Vegas from January 5th to 8th and Etron Tech Group would like to invite you to this prestigious event. CES is the most important tech event in the world. Etron uses IC products to achieve "Pervasive IntelligenceHeterogeneous Integration", which equips electronic products with AI and the abilities of the brain, eyes and nerves, as well as privacy, to create innovative products and enrich life values.
To facilitate design-in for AI and deep learning/information security, the award-winning DeCloakFace will be on display alongside DeCloak's latest innovation on January 3 at the (1) CES Unveiled Las Vegas, (2) CES 2023 Innovation Award Showcase (Venetian Expo, Hall D, Booth #56320), (3) Taiwan Tech Arena (Eureka PARK, Booth #62500), (4) Etron Tech Group (LVCC, Central Hall, Booth #15769) during CES 2023 exhibition period. System builders are welcome to experience our innovative and industry-leading products and explore business collaboration opportunities. For more information, seehttps://de-cloak.com/de/home-de/.
About eYs3D microelectronics
eYs3D Microelectronics Corp. is a pioneer in 3D sensor technologies and aims to develop semiconductor-oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as working closely with its parent company Etron Technology, Inc. and ARM Holdings Plc. eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer-level automation to become a leading brand in the computer vision processing market. Visit www.eys3d.com for more information
DeCloak's privacy computing solutions can be deployed through either software or hardware. With DeCloak's patented corresponding AI prediction algorithm, all processed data can remain highly analyzable while maintaining absolute privacy. The processed data is transmitted to the background or the cloud in an unidentified format, and companies can use the AI predictive model to perform data analysis and design big data trends.
About Etron Technology, Inc.
Etron Technology, Inc. (TPEx: 5351.TW) is a world-class fabless and heterogeneous integration IC design company specializing in Application Controlled Buffer Memory, Known Good Die Memory (KGDM) and Long Retention Time DRAM (RPC DRAM) and other artificial intelligence and machine learning induced DRAM products. Etron also develops system-in-packages, including USB Type-C high-speed transmission interface chips and 3D depth-sensing computer vision and panoramic image capture chips.
Etron Technology America
Press Kit for CES 2023
Etron Tech Frau Justine Tsai Tel: +886-3-578-2345 #8670 E-Mail:firstname.lastname@example.org